Power chips are connected to exterior circuits with product packaging, and their efficiency depends upon the support of the product packaging. In high-power situations, power chips are usually packaged as power components. Chip affiliation describes the electric connection on the upper surface area of the chip, which is usually aluminum bonding cord in standard modules. ^
Traditional power component bundle cross-section
Today, commercial silicon carbide power components still primarily utilize the product packaging innovation of this wire-bonded typical silicon IGBT component. They face troubles such as big high-frequency parasitic criteria, insufficient warm dissipation ability, low-temperature resistance, and inadequate insulation strength, which limit the use of silicon carbide semiconductors. The display screen of excellent efficiency. In order to fix these troubles and totally manipulate the massive possible benefits of silicon carbide chips, many brand-new product packaging modern technologies and services for silicon carbide power modules have emerged recently.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold wires to copper wires, and the driving pressure is cost reduction; high-power tools have actually established from light weight aluminum cables (strips) to Cu Clips, and the driving force is to boost product performance. The better the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a strong copper bridge soldered to solder to link chips and pins. Compared with standard bonding product packaging techniques, Cu Clip modern technology has the complying with benefits:
1. The connection between the chip and the pins is made from copper sheets, which, to a specific level, changes the standard cable bonding approach between the chip and the pins. As a result, a special plan resistance value, greater existing flow, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the cost of silver plating and poor silver plating.
3. The item appearance is totally consistent with typical items and is mostly used in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power products, and other areas.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding approach is extra expensive and complicated, but it can accomplish better Rdson and better thermal effects.
( copper strip)
Copper sheet plus wire bonding approach
The resource pad makes use of a Clip approach, and eviction makes use of a Cord technique. This bonding approach is a little more affordable than the all-copper bonding method, saving wafer location (relevant to extremely tiny gate areas). The process is easier than the all-copper bonding technique and can obtain much better Rdson and much better thermal result.
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